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Your position:Home > News > Industry News > 1366 Technologies meets 5MW bo.....

1366 Technologies meets 5MW boiler milestone

  • Author:John
  • Release on :2014-10-31

US-Based ‘Direct Wafer’ producer, 1366 Technologies has met a key assembly anniversary set a year ago of bearing 5MW per year for anniversary boiler that is claimed to be on par with accepted batten casting furnaces acclimated in bearing the all-over multicrystalline wafer.

As a result, the start-up aggregation affairs to accept three "copy exact" furnaces operational in the aboriginal division of 2015, said to be the final footfall afore architecture its ahead appear 250MW dent facility.

However, the aggregation has aswell said that added key metrics accept aswell been accomplished that are advised to defended the access of the new facility.

1366 Technologies said it had alone of the "low ability tail" in multi c-Si dent production, which is an affair with batten casting techniques that backpack college than capital algae and poor apparent characteristics at assorted areas of formed ingots. Wafers produced from these sections of an batten accept lower ability ratings and are generally re-melted or awash in lower assuming modules and low margins.

1366 Technologies claims a awful conformal and repeatable action as anniversary dent is developed one-at-a-time, beneath controlled conditions.

“Manufacturing is the science of abbreviation variability. In acid the tail, we’ve alone the advanced superior alterity associated with today’s multi-crystalline wafers,” said Frank van Mierlo, CEO, 1366 Technologies. “Our acquirements ambit is faster and our abeyant for college all-embracing efficiencies is greater because our innovations are that abundant bigger than accepted silicon casting. We not alone badly abate the amount of authoritative wafers, we accomplish the wafers better.

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